AN OVERALL LTCC PACKAGE SOLUTION FOR X BAND TILE T/R MODULE

      An overall Low-Temperature Co-flred Ceramics (LTCC) package solution for X-band T/R module has been presented in this paper. This tile type package contributes to a dramatic reduction in size and weight of the T/R module. Moreover, an obvious merit of ceramic housing is better consistency of Coe-cient of Thermal Expansion (CTE), compared with the traditional combination of ceramic board and metal housing. The schematic diagram and 3-D structure of the T/R module have been presented and a novel vertical interconnection based on Ball Grid Array (BGA) has been proposed to connect vias in the lid and those in the stage of the main LTCC pan. The LTCC T/R module has been fabricated and measured. It is compact in size (20 £ 20 £ 2:6mm 3 ) and has a weight of 3.5g. The measured transmit output power is 33§1dBm in the frequency range from 8.8GHz to 10.4GHz, and the measured receive gain and Noise Figure are 29{30.5dB and 2.6{2.8dB, respectively.