An overall Low-Temperature Co-flred Ceramics (LTCC) package solution for X-band T/R module has been presented in this paper. This tile type package contributes to a dramatic reduction in size and weight of the T/R module. Moreover, an obvious merit of ceramic housing is better consistency of Coe-cient of Thermal Expansion (CTE), compared with the traditional combination of ceramic board and metal housing. The schematic diagram and 3-D structure of the T/R module have been presented and a novel vertical interconnection based on Ball Grid Array (BGA) has been proposed to connect vias in the lid and those in the stage of the main LTCC pan. The LTCC T/R module has been fabricated and measured. It is compact in size (20 £ 20 £ 2:6mm 3 ) and has a weight of 3.5g. The measured transmit output power is 33§1dBm in the frequency range from 8.8GHz to 10.4GHz, and the measured receive gain and Noise Figure are 29{30.5dB and 2.6{2.8dB, respectively.

tile type structure based on fuzz button solderless vertical interconnection shows wide band characteristic of about 30 % bandwidth in X-band with insertion loss of below 0.6 dB and input and output VSWR of less than 1.7. Moreover, the mismatching generally appeared in the vertical interconnection which shown wide band characteristic can also be minimized and, therefore, good gain flatness can be achieved.