board to board connection

1、Diameter 0.38mm, length 3.0mm 2、Small size, small pitch 0.5mm, high frequency 60G 3、Board-to-Board connections 4、Vertical connection 5、Zero-insertion force 6、Solderless connection 7、End face elastic contact 8、Large-tolerance design

Zero-insertion force Low Profile Solderless connection End face elastic contact High speed performance Large-tolerance design Large radial and axial misalignment Low applied material and assembly costs Single connector design – no mating connectors needed Board-to-Board connections Vertical connection

1、Diameter 0.76mm, super length 3.0mm 2、Small size, small pitch 1.0mm, high frequency 40G 3、Board-to-Board connections 4、Vertical connection 5、Zero-insertion force 6、Solderless connection 7、End face elastic contact 8、Large-tolerance design

1、Diameter 1.02mm, length 2.5mm 2、Small size, small pitch 1.2mm, high frequency 30G 3、Can withstand 3--5A high current, suitable for power supply 4、Can transmit low frequency signals, digital signals and RF signals 5、Single connector design, no mating connector required, zero mating force 6、Board-to-board connection, 2.3mm board spacing, ultra-thin profile 7、Vertical connection, end face elastic contact, solderless connection 8、High-speed transmission performance, up to 30G

1、Diameter 1.02mm, length 5.0mm 2、Can withstand 3--5A high current, suitable for power supply 3、Can transmit low frequency signals, digital signals and RF signals 4、Single connector design, no mating connector required, zero mating force 5、Board-to-board connection, 4.8mm board spacing, ultra-thin profile 6、Vertical connection, end face elastic contact, solderless connection 7、High-speed transmission performance, up to 30G 8、High density with pitch as small as 1.2mm 9、Large tolerance design, large radial and axial misalignment 10、Low usage and assembly costs

1、Diameter 1.02mm, length 5.0mm，High current Fuzz Button 2、Can withstand 7--10A high current, suitable for power supply 3、Can transmit low frequency signals, digital signals and RF signals 4、Single connector design, no mating connector required, zero mating force 5、Board-to-board connection, 1.2mm board spacing, ultra-thin profile 6、Vertical connection, end face elastic contact, solderless connection 7、High-speed transmission performance, up to 20G 8、High density with pitch as small as 1.8mm

1、Diameter 1.26mm, length 2.0mm（after Press fit） 2、50 ohm impedance, high frequency 65G 3、Board-to-Board connections 4、Vertical connection 5、Zero-insertion force 6、Solderless connection, PCB Compression replace Glass-Bead/glass insulator 7、End face elastic contact